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Max size: 110mmx610mm
Max board thickness: 6.5mmatio: 25:1
Max aspectl
Backplanes
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Workmanship:DPC,DBC,COB
Min hole size: 0.1mm
Max copper thickness:15um-200umrsion silver
Surface finish: Immersion gold Imm
Board thickness: >0.2mm
PTH: Via-filling plating Vias filled withsilver paste
Ceramic substrate
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Max Layer: 24
Material: Rogers Taconic Panasonic TUC PTFE
Layer stack up: Single material mixed dielectricmetal base
Surface finish: OSP, ENIG, Immersion Tin.Immersion Silver
High Frequency board
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Material: PTFE+FR4Line width precision: 8um
Special Technology: Blind Via, POFV
Technical advantages: PTFE series multilayer.mixed pressing technology
EA: ≤15um
mmWave radar PCB
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Material: High Tg, high thermal conductivity Material
Dielectric thickness: >0.09mm
Inner copper weight: s120z
Max Layer: 24Layer
Featured technology: Heavy copper PCB with depthmilling
Heavy Copper PCB
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Min line width: 3mil
Min hole: 0.2mm
Tolerance for impedance control: +10%
Maximum layer count: 108
Multilayer PCB
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Max Laver: 4
Materials: Aluminum Copper
Max copper thickness:≤ 120z
Layer count: 1layer 2layer 4laver
Coefficient of thermal conductivity: 2-12w/m·k
Metal Base PCB
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Max Layer: 16
Max layers for Flex: 8
Min Line Width: 2.5mil
Rigid+Flexible PCB
