Ceramic substrate
Workmanship:DPC,DBC,COB
Min hole size: 0.1mm
Max copper thickness:15um-200umrsion silver
Surface finish: Immersion gold Imm
Board thickness: >0.2mm
PTH: Via-filling plating Vias filled withsilver paste
Product Description
Workmanship:DPC,DBC,COB
Min hole size: 0.1mm
Max copper thickness:15um-200umrsion silver
Surface finish: Immersion gold Imm
Board thickness: >0.2mm
PTH: Via-filling plating Vias filled withsilver paste
Application Cases
Security products
IOT Inernet of Things
Power Supply
Communications
Medical Products
